| First quarter revenues of $2.36 billion grew 13.5% year over year and decreased 1.1% sequentially. | ||
| Net income per diluted share was $0.14 for the first quarter compared to $ -0.03 in the year ago quarter. | ||
| Net operating cash flow was $187 million in the quarter. |
1
2
In Million US$ | Q1 2006 | |||||||||||
Operating | ||||||||||||
Net | % of Net | income | ||||||||||
Segment | Revenues | Revenues | (loss) | |||||||||
Application Specific Product Group* |
$ | 1,317 | 55.7 | % | $ | 95 | ||||||
MPA (Micro, Power & Analog)** |
491 | 20.8 | % | 64 | ||||||||
MPG (Memory Products Group) |
539 | 22.8 | % | 1 | ||||||||
Others (1)(2) |
17 | 0.7 | % | (20 | ) | |||||||
TOTAL |
$ | 2,364 | 100 | % | $ | 140 | ||||||
* | Automotive; Computer Peripheral; and Home, Personal, and Communication products | |
** | Effective January 1, 2006 the Microcontroller, Linear and Discrete (MLD) Group was renamed as the Micro, Power and Analog (MPA) product segment to better reflect product portfolio focus and increased capabilities in advanced Analog. No change occurred in the Groups perimeter or organization. | |
(1) | Net revenues of Others include revenues from sales of Subsystems and other products not allocated to product segments. | |
(2) | Operating loss of Others includes items such as impairment, restructuring charges, and other related closure costs, start-up costs, and other unallocated expenses such as strategic or special research and development programs, certain corporate-level operating expenses, certain patent claims and litigations, and other costs that are not allocated to the product segments, as well as operating earnings or losses of the Subsystems and Other Products segment. Certain costs, mainly R&D, formerly in the Others category, have been allocated to the segments. |
3
% of Net Revenues | ||||
Automotive |
15 | % | ||
Consumer |
16 | % | ||
Computer |
17 | % | ||
Telecom |
38 | % | ||
Industrial & Others |
14 | % |
4
| In mobile communications, ST announced the STn8815, the third generation of Nomadik mobile multimedia application processor family, and an endorsement from Nokia. The Nomadik family also gained an automotive design win, in an application to deliver video over DMB (Digital Multimedia Broadcast) in the car, from a European OEM. | ||
| ST announced volume production of its STLC4370 Wireless LAN (WLAN) IEEE802.11g solution, designed for cellular handsets. This low-power solution has already been designed into several Wi-Fi-enabled cellular handsets. | ||
| ST started sampling its next-generation Bluetooth device to several tier-one mobile phone customers. The new product combines Bluetooth with FM and RDS (Radio Data System) functionality and is believed to offer the worlds lowest power consumption together with the lowest number of required external components. | ||
| Maintaining the momentum that propelled ST to the number one position for mobile phone camera modules, ST launched two more important imaging devices: the STV0984 image system controller supports two SMIA-compliant sensors with resolution of up to 2 megapixels in an ultra-low-power imaging solution and the VS6624 single-chip 1.3-megapixel camera subsystem integrates a CMOS sensor with a digital image processor and analog system functions in a tiny package for high-volume mobile applications. | ||
| In communications infrastructure markets, ST announced its turnkey solution for the new mobile WiMAX-standard (802.16e) base-station modems and consolidated its worldwide leadership in high-speed BiCMOS technologies by launching a partnership with Finisar, the market leader in the high-speed transceivers solutions for optical communications. Finisar will use STs BiCMOS technology for all its new optical module development. | ||
| ST launched the STi5188 low-cost satellite set-top box (STB) decoder chip for high-volume free-to-air (FTA) markets in Asia, the Middle East, Africa, South America, and Europe. This highly integrated device enables digital receivers to compete in cost with analog sets. ST also announced with AMD the commitment to bring immersive digital entertainment to advanced TVs; the first step in this effort is a network-connected STB reference design based on the STB7100 single-chip HDTV solution. | ||
| ST introduced the DTV100, a high-performance dual-channel digital TV solution. The Company simultaneously announced a worldwide-standard-compliant reference design based on the STD2000, STs latest single-chip high-definition TV processor, which can decode and display analog and digital broadcasts. | ||
| ST gained an important design win for the STV82x8 family of digital audio decoder/processor chips, which it announced this quarter. The device will be used in a flat-panel TV project at Samsung. ST also started volume delivery of its STA323W digital-input Class-D power amplifier to all the main flat-panel TV customers including Samsung, LG, Panasonic, and Humax. |
5
| ST and Freescale announced a wide-ranging initiative covering high-performance, cost-effective 32-bit microcontrollers. The initiative focuses on automotive applications and includes the creation of a joint design team to develop products to address powertrain, safety, navigation and multimedia applications, based on aligned 90nm embedded Flash process technology, and also the supply of STs high-voltage power MOSFET and IGBT chips with the possible future transfer of the underlying technologies. | ||
| In powertrain and safety, ST gained several design wins: a Japanese OEM selected an ST kit for electronic power steering for a 2008 model-year car; a tier-one European customer chose an ST powertrain kit for a US car makers 2009 model-year vehicle; and a major Chinese OEM awarded ST a major kit for engine control. | ||
| In telematics, ST captured a design win for a CD servo IC with MP3 decoder from a major Chinese OEM, two important design-ins for custom SoCs for GPS applications, and consolidated its strong position in the digital satellite radio market by sampling three new chips, implemented in 90nm technology, for production in Q4 2006. | ||
| In automotive body applications, STs market leadership in intelligent high power modules was strengthened by several design wins from major OEMs in Europe and the US. ST also achieved design wins in smart power ICs with major OEMs in China. | ||
| In computer systems, ST gained two design wins at a leading printer manufacturer: the first for a mixed-signal ASIC for use in a number of new models of an inkjet printer family; the second for a 90nm digital ASIC for use in the mid-range models in multifunction printer and photo printer families. | ||
| In data storage, ST achieved a design win for its next-generation 90nm SoC solutions with a major hard-disk drive (HDD) manufacturer for mobile and desktop HDD applications. Already in production with a 130nm solution, the new family expands the portfolio of SoCs based on ST-developed Intellectual Property specifically for read-channel and serial interface chips. | ||
| STs innovative In-Check Lab-on-Chip continues to attract developers. ST and Veredus Laboratories announced efforts to develop a fast, point-of-need diagnostic product to enable health-care practitioners to detect strains of Avian Flu and other influenza viruses within approximately one hour of testing. |
| In Flash memory, at the International Solid State Circuits Conference (ISSCC), ST unveiled details of an advanced 4 Gigabit Multi-Level Cell NAND Flash memory that achieves 50% greater throughput than any previous results from any company. Additionally, ST released details of a new MCP (Multi-Chip Package) NAND Flash portfolio for multimedia applications in 3G and CDMA mobile phones and other portable devices. | ||
| ST also announced a new 128-Mbit Serial Flash device, the M25P128, which is intended principally for code storage in a broad range of high performance, cost sensitive, computer and consumer applications. |
6
| To address the fast-growing ZigBee wireless networking market for remote monitoring, control, and sensor-network applications, ST signed an agreement with Ember to jointly develop a complete roadmap of next-generation ZigBee solutions, including hardware, software, and tools. | ||
| ST launched the ST7FLITEUS series of 8-bit microcontrollers, which includes a full set of peripherals, in tiny 8-pin packages. These MCUs suit simple, cost-sensitive applications such as security, lighting, and motor control. ST also introduced a series of low-cost microcontrollers within the ST7Lite family and larger SRAM versions of the high-performance 8051-based uPSD3400 Turbo Plus microcontroller series. | ||
| The Companys STR7 family of 32-bit ARM-based Flash microcontrollers was adopted by a leading European manufacturer as a general microcontroller platform for industrial power management, with designs in circuit breakers, communication modules, and motor-protection equipment. | ||
| Aiming to expand its presence in home- and building-automation applications and Automatic Meter Reading (AMR) systems, ST announced the ST7538P and ST7540 power-line transceivers and introduced a motor-control reference design kit that simplifies the evaluation and implementation of practical 3-phase BLDC (Brushless Direct Current) and AC drive applications across three power ranges, up to 3kW. | ||
| In amplifier and linear products, ST announced the TS4962 compact Class-D audio power amplifier, which gained an important design win from a major manufacturer for several mobile phone platforms; and two new 300MHz amplifiers, the TSH340/1, which drive very high-definition signals on 75-ohm video lines in high-end industrial and medical imaging systems, and in HDTV-enabled set-top boxes and DVD players. | ||
| In advanced analog, ST gained a design win for real-time clock ICs and an audio DAC ASIC with a major customer for a multi-function printer application; and the STM6720 multi-voltage reset IC gained a design win in a set-top box platform with Scientific Atlanta. | ||
| Following the launch of a worldwide marketing effort, ST secured a series of design wins for high-voltage IGBTs for various applications, including air conditioners, lighting, and induction cookers. |
7
| future developments of the world semiconductor market, in particular the future demand for semiconductor products in the key application markets and from key customers served by our products; | ||
| pricing pressures, losses, or curtailments of purchases from key customers; | ||
| the financial impact of obsolete or excess inventories if actual demand differs from our anticipations; | ||
| changes in the exchange rates between the U.S. Dollar and the Euro, compared to the effective exchange rate of $1.21= 1, and between the U.S. Dollar and the currencies of the other major countries in which we have our operating infrastructure; | ||
| our ability to manage our fixed costs structure, including our ability to adequately utilize our manufacturing facilities at sufficient levels to cover fixed operating costs in an intensively competitive and cyclical industry; | ||
| our ability in an intensive competitive environment, to secure customer acceptance and to achieve our pricing expectations for high volume supplies of our new products currently under development; | ||
| the anticipated benefits of research & development alliances and cooperative activities and the continued pursuit of our various alliances, in the field of development of new advanced technologies or products; | ||
| the ability of our suppliers to meet our demands for supplies and materials and to offer competitive pricing; | ||
| changes in the economic, social, or political environment, as well as natural events such as severe weather, health risks, epidemics or earthquakes in the countries in which we and our key customers operate; | ||
| changes in our overall tax position as a result of changes in tax laws or the outcome of tax audits; | ||
| our ability to obtain required licenses on third-party intellectual property, the outcome of litigations and the results of actions by our competitors. |
8
INVESTOR RELATIONS: Stanley March Vice President, Investor Relations Tel: +1.212.821.89.39 Fax: +1.212.821.89.23 Email:stan.march@st.com MEDIA RELATIONS: Maria Grazia Prestini Corporate Media and Public Relations STMicroelectronics Phone: + 41 22 929 6945 Mariagrazia.prestini@st.com |
Fabrizio Rossini Investor Relations Senior Manager Tel: +41.22.929.69.73 Fax: +41.22.929.69.61 Email: fabrizio.rossini@st.com |
9
Three Months Ended | ||||||||
(Unaudited) | (Unaudited) | |||||||
April 1, | April 2, | |||||||
2006 | 2005 | |||||||
Net sales |
2,363 | 2,081 | ||||||
Other revenues |
1 | 2 | ||||||
NET REVENUES |
2,364 | 2,083 | ||||||
Cost of sales |
(1,527 | ) | (1,398 | ) | ||||
GROSS PROFIT |
837 | 685 | ||||||
Selling, general and administrative |
(256 | ) | (265 | ) | ||||
Research and development |
(409 | ) | (404 | ) | ||||
Other income and expenses, net |
(19 | ) | (6 | ) | ||||
Impairment, restructuring charges and other related closure costs |
(13 | ) | (78 | ) | ||||
Total Operating Expenses |
(697 | ) | (753 | ) | ||||
OPERATING INCOME (LOSS) |
140 | (68 | ) | |||||
Interest income, net |
22 | 7 | ||||||
Loss on equity investments |
(4 | ) | 0 | |||||
INCOME (LOSS) BEFORE INCOME TAXES
AND MINORITY INTERESTS |
158 | (61 | ) | |||||
Income tax benefit (expense) |
(28 | ) | 31 | |||||
INCOME (LOSS) BEFORE MINORITY INTERESTS |
130 | (30 | ) | |||||
Minority interests |
2 | (1 | ) | |||||
NET INCOME (LOSS) |
132 | (31 | ) | |||||
EARNINGS (LOSS) PER SHARE (BASIC) |
0.15 | (0.03 | ) | |||||
EARNINGS (LOSS) PER SHARE (DILUTED) |
0.14 | (0.03 | ) | |||||
NUMBER OF WEIGHTED AVERAGE |
||||||||
SHARES USED IN CALCULATING |
956.1 | 893.1 | ||||||
DILUTED EARNINGS (LOSS) PER SHARE |
Three Months Ended | ||||||||
April 1, | April 2, | |||||||
In million of U.S. dollars | 2006 | 2005 | ||||||
(Unaudited) | (Unaudited) | |||||||
Cash flows from operating activities: |
||||||||
Net income (loss) |
132 | (31 | ) | |||||
Items to reconcile net income (loss) and cash flows from operating activities |
||||||||
Depreciation and amortization |
452 | 506 | ||||||
Amortization of discount on convertible debt |
3 | 1 | ||||||
Other non-cash items |
3 | 2 | ||||||
Minority interest in net income (loss) of subsidiaries |
(2 | ) | 1 | |||||
Deferred income tax |
(13 | ) | (23 | ) | ||||
Loss on equity investments |
4 | 0 | ||||||
Impairment, restructuring charges and other related closure costs, net of cash payments |
(11 | ) | 60 | |||||
Changes in assets and liabilities: |
||||||||
Trade receivables, net |
(83 | ) | (24 | ) | ||||
Inventories, net |
(53 | ) | (65 | ) | ||||
Trade payables |
93 | (57 | ) | |||||
Other assets and liabilities, net |
52 | (11 | ) | |||||
Net cash from operating activities |
577 | 359 | ||||||
Cash flows from investing activities: |
||||||||
Payment for purchases of tangible assets |
(297 | ) | (564 | ) | ||||
Payment for purchases of marketable securities |
0 | (525 | ) | |||||
Investment in short-term deposits |
(903 | ) | 0 | |||||
Investment in intangible and financial assets |
(23 | ) | (11 | ) | ||||
Capital contributions to equity investments |
(70 | ) | 0 | |||||
Net cash used in investing activities |
(1,293 | ) | (1,100 | ) | ||||
Cash flows from financing activities: |
||||||||
Proceeds from issuance of long-term debt |
1,564 | 0 | ||||||
Repayment of long-term debt |
(49 | ) | (20 | ) | ||||
Decrease in short-term facilities |
(11 | ) | (19 | ) | ||||
Capital increase |
3 | 1 | ||||||
Net cash from (used in) financing activities |
1,507 | (38 | ) | |||||
Effect of changes in exchange rates |
13 | (9 | ) | |||||
Net cash increase (decrease) |
804 | (788 | ) | |||||
Cash and cash equivalents at beginning of the period |
2,027 | 1,950 | ||||||
Cash and cash equivalents at end of the period |
2,831 | 1,162 |
As at | April 1, | December 31, | April 2, | |||||||||
In million of U.S. dollars | 2006 | 2005 | 2005 | |||||||||
(Unaudited) | (Audited) | (Unaudited) | ||||||||||
ASSETS |
||||||||||||
Current assets: |
||||||||||||
Cash and cash equivalents |
2,831 | 2,027 | 1,162 | |||||||||
Marketable securities |
0 | 0 | 525 | |||||||||
Short-term deposits |
903 | 0 | 0 | |||||||||
Trade accounts receivable, net |
1,563 | 1,490 | 1,414 | |||||||||
Inventories, net |
1,479 | 1,411 | 1,369 | |||||||||
Deferred tax assets |
152 | 152 | 141 | |||||||||
Other receivables and assets |
563 | 531 | 740 | |||||||||
Total current assets |
7,491 | 5,611 | 5,351 | |||||||||
Goodwill |
223 | 221 | 228 | |||||||||
Other intangible assets, net |
218 | 224 | 250 | |||||||||
Property, plant and equipment, net |
6,152 | 6,175 | 7,039 | |||||||||
Long-term deferred tax assets |
66 | 55 | 59 | |||||||||
Investments and other non-current assets |
235 | 153 | 119 | |||||||||
6,894 | 6,828 | 7,695 | ||||||||||
Total assets |
14,385 | 12,439 | 13,046 | |||||||||
LIABILITIES AND SHAREHOLDERS EQUITY |
||||||||||||
Current liabilities: |
||||||||||||
Bank overdrafts |
0 | 11 | 37 | |||||||||
Current portion of long-term debt |
1,509 | 1,522 | 158 | |||||||||
Trade accounts payable |
1,084 | 965 | 1,027 | |||||||||
Other payables and accrued liabilities |
650 | 642 | 852 | |||||||||
Deferred tax liabilities |
6 | 7 | 7 | |||||||||
Accrued income tax |
170 | 152 | 157 | |||||||||
Total current liabilities |
3,419 | 3,299 | 2,238 | |||||||||
Long-term debt |
1,825 | 269 | 1,702 | |||||||||
Reserve for pension and termination indemnities |
270 | 270 | 265 | |||||||||
Long-term deferred tax liabilities |
51 | 55 | 50 | |||||||||
Other non-current liabilities |
16 | 16 | 22 | |||||||||
2,162 | 610 | 2,039 | ||||||||||
Total liabilities |
5,581 | 3,909 | 4,277 | |||||||||
Commitment and contingencies |
||||||||||||
Minority interests |
48 | 50 | 49 | |||||||||
Common stock (preferred stock: 540,000,000 shares authorized, not issued;
common stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized, 908,025,619 shares
issued, 894,625,619 shares outstanding) |
1,153 | 1,153 | 1,150 | |||||||||
Capital surplus |
1,974 | 1,967 | 1,925 | |||||||||
Accumulated result |
5,559 | 5,427 | 5,237 | |||||||||
Accumulated other comprehensive income |
418 | 281 | 756 | |||||||||
Treasury stock |
(348 | ) | (348 | ) | (348 | ) | ||||||
Shareholders equity |
8,756 | 8,480 | 8,720 | |||||||||
Total liabilities and shareholders equity |
14,385 | 12,439 | 13,046 | |||||||||
STMicroelectronics N.V. | ||||
Date: April 26, 2005
|
By: | /s/ Carlo Ferro | ||
Name: Carlo Ferro Title: Executive Vice President and Chief Financial Officer |
||||
· |